Fabrication of fluorinated graphene based aramid nanofibers films with excellent thermal conductivity and mechanical properties
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Author
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Minh-Canh VuThe University of Danang – Advanced Institute of Science and Technology, Danang, VietnamMinh-Sang TranThe University of Danang - University of Science and Technology, Danang, VietnamQuang Bang TaoThe University of Danang - University of Science and Technology, Danang, VietnamVan-Thanh HoangThe University of Danang - University of Science and Technology, Danang, Vietnam
Từ khóa:
Thermal conductivity
mechanical properties
fluorinated graphene (FG)
aramid nanofiber (ANF)
vacuum filtration
Tóm tắt
The rapid advancement of technology has spurred the development of a wide range of sophisticated electronic devices leading to an increasing demand for the utilization of thermoconductive materials to address thermal management. However, most of the available thermoconductive materials possess inadequate mechanical properties and low resistance to temperatures. To address this limitation, this study focuses on fabricating the thermoconductive films using aramid nanofiber (ANF) as strengthening components and fluorinated graphene (FG) as a thermoconductive filler. The films are prepared through the simple vacuum filtration method. The obtained FG/ANF film with 40 wt% of FG reached the in-plane thermal conductivity of 9 W/mK. Additionally, the FG40/ANF film exhibits excellent mechanical properties, including a tensile strength exceeding 110 MPa and toughness greater than 7.2 MJ/m³. Given these remarkable characteristics, the FG/ANF film holds significant promise as a material for dissipating heat in electronic devices, particularly in applications that demand high mechanical performance and temperature stability.
Tài liệu tham khảo
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Dec 31, 2023
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Cách trích dẫn
Vu, M.-C., M.-S. Tran, Q. B. Tao, và V.-T. Hoang. “Fabrication of Fluorinated Graphene Based Aramid Nanofibers Films With Excellent Thermal Conductivity and Mechanical Properties”. Tạp Chí Khoa học Và Công nghệ - Đại học Đà Nẵng, vol 21, số p.h 12.1, Tháng Chạp 2023, tr 46-50, doi:10.31130/ud-jst.2023.544E.
