Influences of alloy composition and scratching depths on the deformation behavior of FeNiCoCrCux high-entropy alloys under nanoindentation and nanoscratch

https://doi.org/10.31130/ud-jst.2025.23(9B).508E

Tóm tắt: 352 | PDF: 74

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Author

  • Pham Van Trung
    The University of Danang - University of Science and Technology, Danang, Vietnam
    Luu Duc Binh
    The University of Danang - University of Science and Technology, Danang, Vietnam
    Tao Quang Bang
    The University of Danang - University of Science and Technology, Danang, Vietnam
    Nguyen Van Tho
    The University of Danang - University of Science and Technology, Danang, Vietnam
    Tu Quang Duc
    The University of Danang - University of Science and Technology, Danang, Vietnam

Từ khóa:

Nanoindentation
nanoscratch
high entropy alloy
molecular dynamics
deformation mechanism

Tóm tắt

The influence of alloy composition and scratching depth in terms of mechanical properties and microstructural changes of FeNiCoCrCu high-entropy alloys (HEAs) is investigated and evaluated through nanoindentation and nanoscratch techniques via molecular dynamics (MD). The influence of these factors is analyzed by investigating applied force, atomic shear deformation, microstructural alterations, dislocation behavior, and elastic restoration capacity. It is highlighted that the primary mode of deformation throughout the indentation and scratching of FeNiCoCrCu alloys involves the initiation and spread of dislocations and stacking faults. The forces during indentation and scratching generally rise with decreasing Cu content and increasing scratch depth. Additionally, the displacement of atoms in diverse directions results in distinct pile-up morphologies.

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Sep 30, 2025
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Trung, P. V., L. D. Binh, T. Q. Bang, N. V. Tho, và T. Q. Duc. “Influences of Alloy Composition and Scratching Depths on the Deformation Behavior of FeNiCoCrCux High-Entropy Alloys under Nanoindentation and Nanoscratch”. Tạp Chí Khoa học Và Công nghệ - Đại học Đà Nẵng, vol 23, số p.h 9B, Tháng Chín 2025, tr 74-80, doi:10.31130/ud-jst.2025.23(9B).508E.

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